CUF TD Module Engineer
Malaysiaonsitemid
Posted today · via Workday
About this role
Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment for CUF (capillary underfill) module and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
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2
Level fit
This role is mid-level. We check your trajectory against it.
3
Domain experience
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4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in Malaysia. We weight your proximity and willingness to relocate.
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teams
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