Packaging Module Development Engineer
USonsitemid$134K – $220K
Posted today · via Workday
About this role
Job Details: Job Description: The Role and Impact As a Packaging Module Development Engineer, you will play a pivotal role in advancing Intel's assembly and packaging technologies. You will develop and optimize processes, equipment, and materials to enable the next generation of innovative packaging solutions. Your daily work will directly contribute to improving manufacturing efficiency and the quality, reliability, and scalability of Intel's products. Business Group Join Intel's Substrate Packaging Technology Development (SPTD) organization, a leader in developing cutting-edge substrate and packaging solutions.…
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reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
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2
Level fit
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3
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4
Recency
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5
Location fit
This role is based in US. We weight your proximity and willingness to relocate.
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teams
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