Packaging Module Equipment Development Engineer
USonsitemid$134K – $189K
Posted today · via Workday
About this role
Job Details: Job Description: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: • Developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1), and SMT/PCB technologies to support Intel's future packaging platforms.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
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2
Level fit
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3
Domain experience
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4
Recency
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5
Location fit
This role is based in US. We weight your proximity and willingness to relocate.
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