Internship - Package Mechanical Simulation

Job Responsibility: The Package Core Technology group is advancing predictive modeling capabilities for semiconductor package reliability through microstructure-based simulation of solder joint behavior. Building on a successful collaboration with the University of Maryland, the next phase of this research focuses on modeling the evolution of solder microstructures and their impact on long-term joint degradation. Develop algorithms that simulate the evolution of solder joint microstructures under mechanical and thermal loading conditions. Translate existing theoretical models and scientific formulations into robust computational implementations within NXP's simulation framework.…