Senior Package Product Solutions Engineer

Tianjin (Xinghua)onsitesenior

Posted today · via Workday

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About this role

Job Description: Understand the semiconductor market and translate market requirements to packaging effectively. Responsible for the design, development, execution, and implementation of packaging product, structures, or assembly process technologies. Address and solve materials and processing issues that may occur during the development process. Develop solutions by working closely with Package Innovation teams including Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing. Familiar with project management by using industry standard project management tools. Collaborate with NXP internal assembly sites and OSATs to qualify product package solutions.…

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