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NxpSr. Product Package Solution Engineer
Tokyoonsitesenior
Posted today · via Workday
About this role
Be the product package solution project leader from Package Innovation R&D team to develop the package solution for Mobile, Secure Communications, Wireless Connectivity, Power, IoT and Radar applications. This position is responsible for leading the packaging projects for New Product Introduction and New Technology Introduction. Executing the projects to ensure that all the packaging deliverables are met to support a New product introduction and time to market. You will coordinate activities across multiple organizations including marketing, IC design, applications, test, assembly engineering, internal and external manufacturing and you will be working with teams across multiple countries.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
For this role: r, sigma, teams
2
Level fit
This role is senior-level. We check your trajectory against it.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in Tokyo. We weight your proximity and willingness to relocate.
Score yourself on this role.
Free · no card · written explanation included
Skills in this role
Pulled from the job description. These are the keywords we'll weight when scoring your fit.
rsigmateams
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